Semiconductor device packages and methods of manufacturing the same

ABSTRACT

A semiconductor device package includes a first conductive layer, a second conductive layer and a third conductive layer. The first conductive layer has a first pitch. The second conductive layer has a second pitch and is arranged at two different sides of the first conductive layer. The third conductive layer has a third pitch and is disposed above the first conductive layer and the second conductive layer. The third conductive layer is electrically connected to the first conductive layer. The first pitch is smaller than the third pitch, and the third pitch is smaller than the second pitch.

BACKGROUND 1. Field of the Disclosure

The present disclosure relates to, amongst other things, semiconductor device packages and methods of manufacturing the same.

2. Description of Related Art

A semiconductor device package may include some semiconductor devices stacked to one another. However, wafer warpage or high thickness may adversely affect performance and efficiency of the semiconductor device package.

SUMMARY

According to some example embodiments of the instant disclosure, a semiconductor device package includes a first conductive layer, a second conductive layer and a third conductive layer. The first conductive layer has a first pitch. The second conductive layer has a second pitch and is arranged at two different sides of the first conductive layer. The third conductive layer has a third pitch and is disposed above the first conductive layer and the second conductive layer. The third conductive layer is electrically connected to the first conductive layer. The first pitch is smaller than the third pitch, and the third pitch is smaller than the second pitch.

According to some example embodiments of the instant disclosure, a semiconductor device package includes a first conductive layer, a first dielectric layer, a second conductive layer, a second dielectric layer and a third conductive layer. The first dielectric layer covers the first conductive layer. The second conductive layer is disposed at two different sides of the first dielectric layer. The third conductive layer is disposed over the first conductive layer and the second conductive layer. The second dielectric layer covers the first conductive layer, the first dielectric layer, the second conductive layer and at least a portion of the third conductive layer. A hardness of the first dielectric layer is larger than a hardness of the second dielectric layer.

According to some example embodiments of the instant disclosure, a method of manufacturing a semiconductor device package includes providing a carrier; disposing a first conductive layer on the carrier; disposing two second conductive layers at different sides of the first conductive layer on the carrier; disposing a third conductive layer above the first conductive layer and the second conductive layers; and connecting two dies to the third conductive layer.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are readily understood from the following detailed description when read with the accompanying figures. It should be noted that various features may not be drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

FIG. 1 is a cross-sectional view of a semiconductor device package in accordance with some embodiments of the present disclosure.

FIG. 2 is a cross-sectional view of another semiconductor device package in accordance with some embodiments of the present disclosure.

FIG. 3 is a cross-sectional view of another semiconductor device package in accordance with some embodiments of the present disclosure.

FIG. 4A, FIG. 4B, FIG. 4C, FIG. 4D, FIG. 4E, FIG. 4F, FIG. 4G, FIG. 4H, FIG. 4I, FIG. 4J and FIG. 4K illustrate various stages of a method for manufacturing a semiconductor device package accordance with some embodiments of the subject application.

FIG. 5A, FIG. 5B, FIG. 5C, FIG. 5D, FIG. 5E, FIG. 5F and FIG. 5G illustrate various stages of a method for manufacturing another semiconductor device package accordance with some embodiments of the subject application.

Common reference numerals are used throughout the drawings and the detailed description to indicate the same or similar elements. The present disclosure will be more apparent from the following detailed description taken in conjunction with the accompanying drawings.

DETAILED DESCRIPTION

The following disclosure provides for many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below. These are, of course, merely examples and are not intended to be limiting. In the present disclosure, reference to the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Embodiments of the present disclosure are discussed in detail below. It should be appreciated, however, that the present disclosure provides many applicable concepts that can be embodied in a wide variety of specific contexts. The specific embodiments discussed are merely illustrative and do not limit the scope of the disclosure.

FIG. 1 is a cross-sectional view of a semiconductor device package 1 in accordance with some embodiments of the present disclosure. The semiconductor device package 1 includes electronic components 11 a, 11 b and 11 c, an interconnection layer 14, and a conductive connection 14 m, which could be deposited on a substrate. The substrate may be a flexible substrate or a rigid substrate, depending upon the specific application.

Each of the electronic components 11 a, 11 b and 11 c includes a plurality of semiconductor devices, such as, but not limited to, transistors, capacitors and resistors interconnected together by a die interconnection structure into functional circuits to thereby form an integrated circuit. In some embodiments, the electronic component 11 c is configured to perform computing or signal transmission between the electronic components 11 a and 11 b. The electronic component 11 c is arranged below the electronic components 11 a and 11 b. Therefore, the semiconductor device package 1 has a relatively large thickness, which may hinder the miniaturization of the semiconductor device package 1

In some embodiments, the electronic components 11 a, 11 b are covered or encapsulated by a package body 12 a. In some embodiments, the package body 12 a includes an epoxy resin including filler therein, a molding compound (e.g., an epoxy molding compound or other molding compound), a polyimide, a phenolic compound or material, a material including a silicone dispersed therein, or a combination thereof.

The interconnection layer 14 includes electrical contacts (such as micro-pads) to which the electronic components 11 a, 11 b are electrically connected. In some embodiments, the interconnection layer 14 is a dielectric layer or a non-silicon interposer (e.g., an organic interposer) and includes a plurality of conductive connection 14 m embedded therein.

In some embodiments, the electronic component 11 a is disposed on the conductive connection 14 m. The electronic component 11 b is disposed adjacent to the electronic component 11 a and on the conductive connection 14 m. The electronic component 11 a is electrically connected to the electronic component 11 b through the conductive connection 14 m and the electronic component 11 c.

The package body 12 b covers or encapsulates the electronic component 11 c and a portion of the conductive connection 14 m. The interconnection layer 14 is disposed on the package body 12 b. The package body 12 b includes an epoxy resin including filler therein, a molding compound (e.g., an epoxy molding compound or other molding compound), a polyimide, a phenolic compound or material, a material including a silicone dispersed therein, or a combination thereof.

The electronic component 11 c and the package body 12 b have different coefficients of thermal expansion (CTE). Because the electronic component 11 c is encapsulated by the package body 12 b, wafer warpage may occur during the manufacturing process (e.g., the RDL, passivation or other processes) due to the mismatch of CTE between the electronic component 11 c and the package body 12 b. This may adversely affect the performance of the semiconductor device package 1.

FIG. 2 is a cross-sectional view of a semiconductor device package 2 in accordance with some embodiments of the present disclosure. The semiconductor device package 2 includes electronic components 21 a and 21 b, interconnection layers 24 a and 24 b, and conductive connection 24 m 1, 24 m 2 and 24 m 3.

Each of the electronic components 21 a, 21 b includes a plurality of semiconductor devices, such as, but not limited to, transistors, capacitors and resistors interconnected together by a die interconnection structure into functional circuits to thereby form an integrated circuit. As will be understood to those skilled in the art, the device side of the semiconductor die includes an active portion including integrated circuitry and interconnection. The electronic components 21 a, 21 b may be any suitable integrated circuit device including, but not limited to, a microprocessor (e.g., single or multi-core), a memory device, a chipset, a graphics device, a high bandwidth memory (HBM), or an application-specific integrated circuit (ASIC) according to several different embodiments. In some embodiments, the electronic component 21 a is referred to as a first die, and the electronic component 21 b is referred to as a second die.

In some embodiments, a plurality of electrical contacts 25 a are disposed on active surfaces of the electronic components 21 a and 21 b to provide electrical connection between the electronic components 21 a, 21 b and other electronic components.

In some embodiments, the electronic components 21 a, 21 b are covered or encapsulated by a package body 22 a. The package body 22 a includes an epoxy resin including filler therein, a molding compound (e.g., an epoxy molding compound or other molding compound), a polyimide, a phenolic compound or material, a material including a silicone dispersed therein, or a combination thereof. The package body 22 a includes a portion of conductive connection 24 m 3 embedded therein. The package body 22 a covers or encapsulates the interconnection layer 24 b (e.g., a top surface of the interconnection layer 24 b). For example, the package body 22 a is disposed on and adjacent to the interconnection layer 24 b.

The interconnection layer 24 b includes electrical contacts (such as micro-pads) to which the electronic components 21 a, 21 b are electrically connected. In some embodiments, the interconnection layer 24 b is a dielectric layer or a non-silicon interposer (e.g., an organic interposer) and includes a plurality of conductive connection 24 m 3 embedded therein.

In some embodiments, the interconnection layer 24 b covers or encapsulates the interconnection layer 24 a. For example, the interconnection layer 24 b is disposed on and surrounds the interconnection layer 24 a. For example, the interconnection layer 24 b is in contact with a top surface and lateral surfaces of the interconnection layer 24 a. In some embodiments, the material of the interconnection layer 24 a is different from the material of the interconnection layer 24 b. More specifically, a hardness of the interconnection layer 24 a is greater than a hardness of the interconnection layer 24 b.

The interconnection layer 24 a includes a plurality of conductive connection (or a redistribution layer (RDL)) 24 m 1 therein. A portion of the conductive connection 24 m 1 of the interconnection layer 24 a is electrically connected to the conductive connection 24 m 3 of the interconnection layer 24 b. For example, the conductive connection 24 m 1 that are electrically connected to the electronic components 21 a, 21 b are electrically connected to the conductive connection 24 m 3 of the interconnection layer 24 b.

The interconnection layer 24 a provides interconnection between the electronic components 21 a and 21 b. The conductive connection 24 m 1 is fine trace embedded within the interconnection layer 24 a. In some embodiments, the line/space (L/S) of the conductive connection 24 m 1 is less than that of the conductive connection 24 m 2 or 24 m 3. The interconnection layer 24 a can serve as a bridge between the electronic components 21 a and 21 b to transmit data with relatively high speed rate therebetween. Compared to the embodiments of FIG. 1, which uses the electronic component 11 c as an interconnection bridge (or link), the interconnection bridge between the electronic components 21 a and 21 b of the semiconductor device package 2 is achieved by the conductive connection 24 m 1, which would reduce the thickness of the semiconductor device package 2.

In some embodiments, the electronic component 21 a is disposed on the conductive connection 24 m 3. The electronic component 21 b is disposed adjacent to the electronic component 21 a and on the conductive connection 24 m 3. The electronic component 21 a is electrically connected to the electronic component 21 b through the conductive connection 24 m 1 and 24 m 3.

As shown in FIG. 2, the electronic component 21 a is disposed over a portion 24 m 1 a of the conductive connection 24 m 1 and a portion 24 m 2 a of the conductive connection 24 m 2 adjacent to the portion 24 m 1 a of the conductive connection 24 m 1. In other words, the portion 24 m 2 a of the conductive connection 24 m 2 is arranged below the electronic component 21 a. The portion 24 m 1 a of the conductive connection 24 m 1 is adjacent to but not in direct contact with the portion 24 m 2 a of the conductive connection 24 m 2. The electronic component 21 b is disposed over a portion 24 m 1 b of the conductive connection 24 m 1 and a portion 24 m 2 b of the conductive connection 24 m 2 is adjacent to the portion 24 m 1 b of the conductive connection 24 m 1. In other words, the portion 24 m 2 b of the conductive connection 24 m 2 is arranged below the electronic component 21 b. The portion 24 m 1 b of the conductive connection 24 m 1 is adjacent to but not in direct contact with the portion 24 m 2 b of the conductive connection 24 m 2.

In some embodiments, the conductive connection 24 m 1 is referred to as a first conductive layer, the conductive connection 24 m 2 is referred to as a second conductive layer, the conductive connection 24 m 3 is referred to as a third conductive layer, the interconnection layer 24 a is referred to as a first dielectric layer, and the interconnection layer 24 b is referred to as a second dielectric layer.

In some embodiments, the conductive connection 24 m 1 has a first pitch (e.g., L/S). The conductive connection 24 m 2 has a second pitch. The conductive connection 24 m 3 has a third pitch and disposed above the conductive connection 24 m 1 and the conductive connection 24 m 2. The conductive connection 24 m 3 electrically connected to the conductive connection 24 m 1. The first pitch is smaller than the third pitch, and the third pitch is smaller than the second pitch.

For example, the conductive connection 24 m 1 of the interconnection layer 24 a is a fine-pitch interconnection or fine line. The conductive connection 24 m 3 of the interconnection layer 24 b is a middle-pitch interconnection or middle line. The conductive connection 24 m 2 of the interconnection layer 24 b is a coarse-pitch interconnection or coarse line. In other words, density of the conductive connection 24 m 1 is larger than density of the conductive connection 24 m 3. Density of the conductive connection 24 m 3 is larger than density of the conductive connection 24 m 2.

In some embodiments, a top surface of the conductive connection 24 m 1 is substantially coplanar with a top surface of the conductive connection 24 m 2. In other embodiments, the top surface of the conductive connection 24 m 1 is slightly higher than the top surface of the conductive connection 24 m 2 in order to electrically connect the conductive connection 24 m 3. In some embodiments, a diameter of the conductive connection 24 m 1 is less than a diameter of the conductive connection 24 m 2 or the conductive connection 24 m 3.

The conductive connection 24 m 1, 24 m 2, 24 m 3 provide interconnection between the electronic components 21 a and 21 b. The interconnection layer 24 a can serve as a bridge or link between the electronic components 21 a and 21 b. In the embodiment of FIG. 1, the electronic component 11 c is encapsulated by the package body 12 b, which could result in wafer warpage during the manufacturing process (e.g., the RDL, passivation or other processes) due to the mismatch of CTE between the electronic component 11 c and the package body 12 b. This may adversely affect the performance of the semiconductor device package 1. Compared to the embodiment of FIG. 1, the interconnection bridge between the electronic components 21 a and 21 b of the semiconductor device package 2 is achieved by the conductive connection 24 m 1 without arranging another electronic component and its associated package body, which would prevent the semiconductor device package 2 from wafer warpage.

FIG. 3 is a cross-sectional view of another semiconductor device package 3 in accordance with some embodiments of the present disclosure. The semiconductor device package 3 is similar to the semiconductor device package 2 except that in FIG. 3, a carrier 30 is disposed on the electronic components 31 a and 31 b to cover or protect the semiconductor device package 3. In some embodiments, the carrier 30 may be a glass carrier or any other type of suitable carrier.

FIG. 4A, FIG. 4B, FIG. 4C, FIG. 4D, FIG. 4E, FIG. 4F, FIG. 4G, FIG. 4H, FIG. 4I, FIG. 4J and FIG. 4K illustrate various stages of a method for manufacturing a semiconductor device package 4 accordance with some embodiments of the subject application. Various figures have been simplified for a better understanding of the aspects of the present disclosure.

Referring to FIG. 4A, a carrier 40 is provided, and an adhesive layer (or a release film) 40 a is formed or deposited on the carrier 40. In some embodiments, the carrier 40 may be a glass carrier or any other type of suitable carrier.

Referring to FIG. 4B, the interconnection layer 44 a is attached to the carrier 40 through the adhesive layer 40 a on the carrier 40. In some embodiments, the interconnection layer 44 a does not completely cover the carrier 40. For example, the interconnection layer 44 a covers a portion of the carrier 40 and exposes another portion of the carrier 40. In addition, the interconnection layer 44 a covers or encapsulates the conductive connection 44 m 1.

Referring to FIG. 4C, the conductive connection 44 m 2 is formed or deposited on the carrier 40 and the adhesive layer 40 a. The conductive connection 44 m 2 is formed on two different sides of the interconnection layer 44 a to surround the conductive connection 44 m 1 and the interconnection layer 44 a. The conductive connection 44 m 2 could also be embedded within a dielectric layer.

In some embodiments, the conductive connections 44 m 1 and 44 m 2 are formed by electroplating or by other suitable techniques. The conductive connections 44 m 1 and 44 m 2 have different pitches. In some embodiments, the conductive connection 44 m 2 is coarse-pitch interconnection or coarse line, and the conductive connection 44 m 1 is fine-pitch interconnection or fine line.

Referring to FIG. 4D, the conductive connection 44 m 3 is formed or deposited on the interconnection layer 44 b. The conductive connection 44 m 3 and the interconnection layer 44 b are formed or deposited on the interconnection layer 44 a and the conductive connections 44 m 1, 44 m 2 in order to provide electrical connections between the conductive connections 44 m 1, 44 m 2 and 44 m 3. Hardness of the interconnection layer 44 b is smaller than that of the interconnection layer 44 a.

Referring to FIG. 4E, etching, grinding or other suitable process is performed of the conductive connection 44 m 3 and the interconnection layer 44 b. For example, laser drill is executed for the conductive connection 44 m 3 and the interconnection layer 44 b to develop a plurality of openings or trenches.

Referring to FIG. 4F, via plating or metal plating is performed corresponding to the developed openings or trenches. A portion of the conductive connections 44 m 3 directly contacts the conductive connections 44 m 1. The pitch of the conductive connections 44 m 1 is smaller than the pitch of the conductive connections 44 m 3, and the pitch of the conductive connections 44 m 3 is smaller than the pitch of the conductive connections 44 m 2.

Referring to FIG. 4G, the electronic components 41 a and 41 b are formed or disposed on the interconnection layer 44 b and electrically connected to the conductive connections 44 m 3. Each of the electronic components 41 a and 41 b includes a plurality of electrical contacts 45 a to provide electrical connections between the electronic components 41 a and 41 b and conductive connection 44 m 3.

A package body 42 a is then formed or disposed to cover or encapsulate the electronic components 41 a and 41 b. In some embodiments, the package body 42 a includes an epoxy resin including fillers, a molding compound (e.g., an epoxy molding compound or other molding compound), a polyimide, a phenolic compound or material, a material including a silicone dispersed therein, or a combination thereof.

Referring to FIG. 4H, a portion of the package body 42 a is removed so that a backside of each electronic component 41 a and 41 b is exposed from the package body 42 a. In some embodiments, the package body 42 a can be removed by grinding, etching or by other suitable processes.

Referring to FIG. 4I and FIG. 4J, the carrier 40 and the adhesive layer 40 a are then removed from the interconnection layers 44 a and 44 b to expose the conductive connections 44 m 1 and 44 m 2. Referring to FIG. 4K, a plurality of solder balls 45 b are formed below to electrically connect the conductive connections 44 m 1 and 44 m 2.

The conductive connection 44 m 1 is embedded within the interconnection layer 44 a to provide electrical connection between the electronic components 41 a and 41 b. The interconnection layer 44 a can serve as a bridge between the electronic components 41 a and 41 b. Therefore, the thickness could be reduced without arranging additional electronic component under the electronic components 41 a and 41 b. The wafer warpage due to CTE mismatch could also be improved or eliminated.

FIG. 5A, FIG. 5B, FIG. 5C, FIG. 5D, FIG. 5E, FIG. 5F and FIG. 5G illustrate various stages of a method for manufacturing another semiconductor device package 5 accordance with some embodiments of the subject application. Various figures have been simplified for a better understanding of the aspects of the present disclosure.

Referring to FIG. 5A, a carrier 50 is provided, and an adhesive layer (or a release film) 50 a is formed or deposited on the carrier 40. In some embodiments, the carrier 40 may be a glass carrier or any other type of suitable carrier. Referring to FIG. 5B, an adhesive layer (or a release film) 50 b is formed or deposited on the adhesive layer 50 a.

Referring to FIG. 5C, the electronic components 51 a and 51 b are formed or disposed on the adhesive layer 50 b. Each of the electronic components 51 a and 51 b includes a plurality of electrical contacts 55 a to provide electrical connections between the electronic components 51 a and 51 b.

Referring to FIG. 5D, package body 52 a is then formed or disposed to cover or encapsulate the electronic components 51 a and 51 b. In some embodiments, the package body 52 a includes an epoxy resin including fillers, a molding compound (e.g., an epoxy molding compound or other molding compound), a polyimide, a phenolic compound or material, a material including a silicone dispersed therein, or a combination thereof.

Referring to FIG. 5E, a portion of the package body 52 a is removed so that a plurality of electrical contacts 55 a is exposed from the package body 52 a. In some embodiments, the package body 52 a can be removed by grinding, etching or by other suitable processes.

Referring to FIG. 5F, interconnection layer 54 a is formed or deposited on the package body 52 a and the electrical contacts 55 a. the interconnection layer 54 a covers or encapsulates the conductive connection 54 m 1. The conductive connection 54 m 2 is formed on two different sides of the interconnection layer 54 a to surround the conductive connection 54 m 1 and the interconnection layer 54 a. The conductive connection 54 m 3 is formed or deposited on the interconnection layer 54 b and the conductive connection 54 m 1 in order to provide electrical connections between the conductive connections 54 m 1, 54 m 2 and 54 m 3.

In some embodiments, the conductive connections 54 m 1, 54 m 2 and 54 m 3 are formed by electroplating or by other suitable techniques. In some embodiments, the conductive connection 54 m 2 is coarse-pitch interconnection or coarse line, the conductive connection 54 m 3 is middle-pitch interconnection or middle line, and the conductive connection 54 m 1 is fine-pitch interconnection or fine line.

The conductive connection 54 m 1 is embedded within the interconnection layer 54 a to provide electrical connection between the electronic components 51 a and 51 b. The interconnection layer 54 a can serve as a bridge between the electronic components 51 a and 51 b. Therefore, the thickness could be reduced without arranging additional electronic component under the electronic components 51 a and 51 b. The wafer warpage due to CTE mismatch could also be improved or eliminated. Referring to FIG. 5G, a plurality of solder balls 55 b are formed above the conductive connection 54 m 3 to electrically connect other semiconductor device packages.

As used herein, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper,” “lower,” “left,” “right” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly. It should be understood that when an element is referred to as being “connected to” or “coupled to” another element, it may be directly connected to or coupled to the other element, or intervening elements may be present.

As used herein, the terms “approximately”, “substantially”, “substantial” and “about” are used to describe and account for small variations. When used in conduction with an event or circumstance, the terms can refer to instances in which the event of circumstance occurs precisely as well as instances in which the event or circumstance occurs to a close approximation. As used herein with respect to given value or range, the term “about” generally means within ±10%, ±5%, ±1%, or ±0.5% of the given value or range. Ranges can be expressed herein as from one endpoint to another endpoint or between two endpoints. All ranges disclosed herein are inclusive of the endpoints, unless specified otherwise. The term “substantially coplanar” can refer to two surfaces within micrometers (μm) of lying along a same plane, such as within 10 within 5 within 1 or within 0.5 μm of lying along the same plane. When referring to numerical values or characteristics as “substantially” the same, the term can refer to the values lying within ±10%, ±5%, ±1%, or ±0.5% of an average of the values.

The foregoing outlines features of several embodiments and detailed aspects of the present disclosure. The embodiments described in the present disclosure may be readily used as a basis for designing or modifying other processes and structures for carrying out the same or similar purposes and/or achieving the same or similar advantages of the embodiments introduced herein. Such equivalent constructions do not depart from the spirit and scope of the present disclosure, and various changes, substitutions, and alterations may be made without departing from the spirit and scope of the present disclosure. 

1. A semiconductor device package, comprising: a first conductive layer having a first pitch, a second conductive layer having a second pitch and arranged at two different sides of the first conductive layer; a third conductive layer having a third pitch and disposed above the first conductive layer and the second conductive layer, the third conductive layer electrically connected to the first conductive layer, wherein the first pitch is smaller than the third pitch, and the third pitch is smaller than the second pitch; a first dielectric layer surrounding the first conductive layer; and a second dielectric layer surrounding the first dielectric layer, the second conductive layer and a portion of the third conductive layer.
 2. The semiconductor device package as claimed in claim 1, further comprising: a first die disposed on the third conductive layer; and a second die disposed adjacent to the first die and on the third conductive layer, wherein the first die is electrically connected to the second die through the first conductive layer.
 3. The semiconductor device package as claimed in claim 2, wherein the first die is disposed over a first portion of the first conductive layer and a first portion of the second conductive layer adjacent to the first portion of the first conductive layer; and the second die is disposed over a second portion of the first conductive layer and a second portion of the second conductive layer adjacent to the second portion of the first conductive layer.
 4. The semiconductor device package as claimed in claim 2, further comprising: a carrier arranged on the first die and the second die.
 5. The semiconductor device package as claimed in claim 1, wherein the second conductive layer surrounds the first conductive layer.
 6. (canceled)
 7. The semiconductor device package as claimed in claim 1, wherein material of the first dielectric layer is different from material of the second dielectric layer.
 8. The semiconductor device package as claimed in claim 7, wherein a hardness of the first dielectric layer is greater than a hardness of the second dielectric layer.
 9. A semiconductor device package, comprising: a first conductive layer; a first dielectric layer covering the first conductive layer; a second conductive layer disposed at two different sides of the first dielectric layer; a third conductive layer disposed over the first conductive layer and the second conductive layer; and a second dielectric layer covering the first conductive layer, the first dielectric layer, the second conductive layer and at least a portion of the third conductive layer, wherein a hardness of the first dielectric layer is larger than a hardness of the second dielectric layer.
 10. The semiconductor device package as claimed in claim 9, wherein the first conductive layer, the second conductive layer and the third conductive layer have different pitches.
 11. The semiconductor device package as claimed in claim 9, further comprising: a first die disposed on the third conductive layer; and a second die disposed adjacent to the first die and on the third conductive layer.
 12. The semiconductor device package as claimed in claim 11, wherein the first die is electrically connected to the second die through the first conductive layer.
 13. The semiconductor device package as claimed in claim 12, wherein: the first die is disposed over a first portion of the first conductive layer and a first portion of the second conductive layer adjacent to the first portion of the first conductive layer; and the second die is disposed over a second portion of the first conductive layer and a second portion of the second conductive layer adjacent to the second portion of the first conductive layer.
 14. The semiconductor device package as claimed in claim 13, wherein the first conductive layer is surrounded by the second conductive layer.
 15. The semiconductor device package as claimed in claim 9, wherein density of the first conductive layer is larger than density of the third conductive layer, and density of the third conductive layer is larger than density of the second conductive layer.
 16. A method of manufacturing a semiconductor device package, comprising: providing a carrier; disposing a first conductive layer on the carrier; disposing two second conductive layers at different sides of the first conductive layer on the carrier; disposing a third conductive layer above the first conductive layer and the second conductive layers; and connecting two dies to the third conductive layer; forming a first dielectric layer to surround the first conductive layer; and forming a second dielectric layer to surround the second conductive layers, the first dielectric layer and a portion of the third conductive layer. 17-18. (canceled)
 19. The method as claimed in claim 16, wherein the first dielectric layer and the second dielectric layer have different hardness.
 20. The method as claimed in claim 16, wherein the first conductive layer, the second conductive layers and the third conductive layer have different pitches. 